- 可靠性试验项目
- 研发所用设备及检测仪器
- 应用领域
Number 序号 |
Experiment Items 试验项目 |
Experiment Method And Conditions 试验方法和条件 |
Reference 参考文献 |
1 |
Solder Resistance Test 耐焊接热试验 |
260℃±5℃ for 10±2sec.Immerse body into solder 1/16'' ±1/32'' 将器件引线浸入熔融的260℃±5℃的焊料中10±2s,浸至距壳体1/16''±1/32''处 |
MIL-STD-750D METHOD-2031 |
2 |
Solderabiliti Tes 可焊性试验 |
245℃±5℃ for 5sec 245℃±5℃,5秒 |
MIL-STD-750D METHOD-2026 |
3 |
Bend Tes 弯曲试验 |
0.5kg Weight Applied To Each Lead Bending Arcs 90±5° For Three Times 用 0.5kg 力对引线进行 90±5 度弯曲,共 3 次 |
MIL-STD-750 METHOD-2036 |
4 |
Pressure Cooker Test |
15 PSIG,TA=121℃,24hrs |
MIL-S-19500 |
5 |
High Temperature |
TA=100℃ for 168 Hrs at VR=80% Rated VR(OJ) |
MIL-STD-750 METHOD-1038 |
TA=125℃ for 168 Hrs at VR=80% Rated VR(GPP) 在 125℃的情况下,施加 80% 额定电压,168 小时 (GPP) |
MIL-STD-750 METHOD-1038 |
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6 |
Forward Surge Test |
8.3 ms Single Hale Sine-wave One Surge |
MIL-STD-750D |
7 |
Forward Operation life Test |
TA=25℃ for 1000 Hrs at Rated Average Rectified Current |
MIL-STD-750D |
8 |
Intermittent Operation Life Test |
On state:5 min with Rated IRMS Power |
MIL-STD-750D |
9 |
Temperature Cycling Test |
-55 ℃ /+150 ℃ 30 Minutes For Dwelled Time 5 |
MIL-STD-750D |
10 |
Thermal Shock Test |
0℃ for 5 min,100℃ for 5 min,Total 10 Cycles |
MIL-STD-750D |
11 |
Humidity Test |
TA=85℃ ,RH=85% for 1000hrs |
MIL-STD-750D |
12 |
High Temperature |
150℃ for 1000 Hrs |
MIL-STD-750D |